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Copper plating intermediate

Copper plating intermediate
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EDTP

                                          EDTP


Chemical nature           
Chemical name: Hexamethylene tramine tra hydroxy propy chloride;
 N,N,N’N’-tetrakis (2-Hydroxypropyl) ethylenedianmine
Molecular formula: C14H32N2O4
Molecular weight: 294.42
CAS No.: 102-60-3
 
Properties         
Physical form: Light yellow to brownish yellow viscous liquid
PH: 8.0-10.0
 
Application     
 EDTP is used as metal complexing agent, used as scaling powder and cleaner in electroless copper PCB plating.


Packing
 25kg/drum, stored in cool and dry place

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